Do different generations of DDR chips look different?

Category : Specification / Capacity / Performance
Most DDR modules adopt TSOP package with pins sticking out from Flash sides. Some DDR chips go with a less common FBGA package which is physically smaller, and uses a grid of tiny solder balls on bottom to make electrical contact with the board. At present, the FBGA package is the standard for all DDR2, DDR3 and DDR4 chips.
Is the answer helpful?

Related

Technische support

If the answer can't help you, you can contact the Tech Support Department

Starten

U hebt al cookies geaccepteerd, maar u kunt uw toestemming op elk gewenst moment intrekken. Zie voor meer informatie onzeCookie Statement. Instellingen veranderen

U hebt cookies al geweigerd, maar u kunt op elk gewenst moment uw toestemming geven. Zie meer voor informatie onze Cookie Statement. Instellingen veranderen